How is PCB assembly cost calculated?

PCB assembly cost depends on PCB specifications, quantity, BOM cost, component packages, SMT/THT complexity, testing, programming, inspection, tooling, and special processes. Turnkey projects can be quoted as an integrated manufacturing package.

When does PCB assembly lead time begin?

PCB assembly lead time normally begins after the order is confirmed, manufacturing data are finalized, all engineering questions (EQs) are resolved, and material availability is confirmed.

Can REGULUS support prototype and mass-production PCB assembly?

Yes. REGULUS supports prototype PCB assembly, engineering builds, pilot production, and mass production, with production planning adapted to project volume and technical requirements.

Custom PCBA Manufacturing to IPC-A-610 Class 1, 2, and 3 Requirements

REGULUS provides custom PCBA manufacturing for your projects requiring SMT, THT/DIP, press-fit, mixed-technology assembly, inspection, testing, and project-defined IPC-A-610 workmanship criteria. We support prototype, low-to-medium-volume, and mass-production builds according to your product design, quality requirements, and production plan.

If your project also requires PCB fabrication, component sourcing, programming, testing, and other turnkey manufacturing support, see our Turnkey PCB Assembly Services.

IPC-A-610 Workmanship & Acceptance Criteria

IPC-A-610 defines acceptance criteria for completed electronic assemblies. We support custom PCBA projects requiring Class 1, Class 2, or Class 3 workmanship criteria as specified in your project requirements.

Class 1 Assembly: Suitable for general electronic products where the primary requirement is the function of the completed assembly.
Class 2 Assembly: Suitable for dedicated service electronic products requiring continued performance and extended life, where uninterrupted service is desired but not critical.
Class 3 Assembly: Intended for high-performance or high-assurance electronic products where continued operation or performance on demand is critical.

IPC-A-610 addresses post-assembly acceptance criteria. Where soldering process requirements are specified, J-STD-001 can be applied separately according to your project requirements.

PCB Assembly Types & Configurations

We support multiple PCB assembly technologies, providing the flexibility required for different board designs, component types, and mechanical requirements:

SMT Assembly: High-speed SMD (Surface Mount Device) placement and SMT (Surface Mount Technology) processes for high-density and fine-pitch PCB assemblies.
THT & DIP Assembly: Through-hole component insertion and soldering for designs requiring THT or Dual In-line Package (DIP) components and additional mechanical retention.
Press-fit Assembly: A solder-free assembly method that uses controlled mechanical force to insert compliant-pin connectors into applicable plated through holes, making it suitable for heat-sensitive assemblies and applications requiring robust mechanical retention and reliable electrical connections.
Mixed Technology Assembly: Integration of SMT, THT/DIP, and press-fit processes on the same PCBA to support different component, performance, and durability requirements.
Double-sided Population: Supports complex PCBA designs by assembling components on both sides of the PCB using SMT, THT/DIP, and press-fit processes where applicable. This approach supports higher component density and space-efficient layouts while accommodating both soldered and solder-free connections according to the assembly design.

SMT / THT Process

PCBA Production Volumes

We support PCBA builds from prototype through mass production, with production planning based on your required quantities, material readiness, testing requirements, and target schedule.

Quick-Turn Prototype PCBA
Low-to-Medium Volume Production
High-Volume Mass Production

The manufacturing approach can be adjusted as your project moves from engineering builds to regular production.

PCBA Technologies & Supporting Processes

Our PCBA manufacturing technologies and supporting processes include:

Automated SMT placement systems
IPC-A-610 Workmanship: Class 1, Class 2, or Class 3 acceptance requirements as specified for your project
Fine-Pitch Component Packages: µBGA, PGA, LGA, BGA, PoP, and 01005 components
Press-Fit Assembly Technology
Lead-Free Processes: Lead-free soldering and applicable materials for projects requiring RoHS-compliant assembly
Automated and Semi-Automated Conformal Coatings
Automated Laser Marking for Traceability

Lead-Free and Leaded PCB Assembly

We support both RoHS-compliant lead-free PCB assembly and traditional leaded (SnPb) PCB assembly to meet different product, application, and regulatory requirements.

Lead-Free PCB Assembly: Uses lead-free solder materials and supports projects requiring RoHS-compliant assembly, including applicable consumer electronics, medical devices, and other products subject to regulatory or environmental requirements.
Lead (SnPb) PCB Assembly: Traditional lead-based soldering offers established solderability and reliability characteristics and remains applicable to certain industrial, aerospace, and high-reliability applications where lead-free assembly is not required or where SnPb solder is specifically permitted or specified.

Both assembly options are integrated into our controlled workflow, including solder paste printing, component placement, reflow or wave soldering as applicable, and multi-stage inspection.

PCBA Inspection & Test Capabilities

We provide inspection and testing capabilities for your PCBA according to component packages, process risks, test requirements, and applicable acceptance criteria:

Solder Paste Inspection (SPI): Real-time 3D measurement of solder paste volume and alignment before component placement to identify printing conditions that may affect soldering quality.
Automated Optical Inspection (AOI): High-speed, high-resolution inspection for component placement errors, polarity, and solder bridge issues after reflow.
X-ray Inspection: Non-destructive inspection of BGA (Ball Grid Array), QFN, and other hidden solder joints, including those used in high-density PCBA layouts.
In-Circuit Testing (ICT) & Functional Testing (FCT): Hardware and software validation used to verify electrical and functional performance against your approved test and firmware requirements.
Flying Probe Testing: A flexible, fixtureless electrical testing method suitable for prototypes and applicable low-volume builds without requiring custom test tooling.
Environmental Stress Screening (ESS) & Burn-In Chambers: Controlled thermal and electrical stress testing used to identify potential early-life failures when specified by your project requirements.
Test System Development: Test fixtures and software environments can be developed according to your specific testing requirements.

PCB Assembly Capability

SMT Assembly Equipment

SMT assembly equipment supports automated component placement and process inspection for PCBA production. See our SMT Assembly Equipment page for equipment details and related production resources.

PCB Assembly Product Portfolio

Our printed circuit assembly solutions support projects across:

Industrial and commercial equipment
Medical and life science devices
Communication and networking systems
Consumer electronics

The examples below show PCB assemblies from our projects across these and other application requirements.

HDI Board Assembly with BGA, black PCBA with multiple ICs, connectors, and gold mounting points.

HDI Board Assembly with BGA, green PCBA with multiple large IC packages and edge connectors.

HDI Board Assembly with BGA, green PCBA with dense components, IC packages, and connector pads.

HDI Board Assembly with BGA, angled PCBA with dense IC packages and gold-plated board edges.

HDI Board Assembly with BGA, green PCBA with large IC packages, a board connector, and dense routing

Green PCBA with through-hole headers, connectors, and mixed surface-mount components.

Green PCBA with gold-plated edges, RF-style connectors, and a patterned copper area.

Green PCBA with sparse component population, plated mounting holes, and board-edge connectors.

Green PCBA with multiple board-mounted connectors, ICs, and mixed electronic components.

Start Your Custom PCBA Review

Preparing a custom PCBA RFQ? Please submit your PCB Assembly Inquiry documents, including your BOM, Gerber files, pick-and-place data, assembly drawings, required quantities, IPC-A-610 class, programming and testing requirements, and target schedule.

A completed Product Survey helps us understand your product application, sourcing responsibility, compliance requirements, and production scope before quotation.

We will clarify any engineering, sourcing, testing, or manufacturing questions needed before quotation.

PCB Assembly Inquiry

Custom PCBA FAQ

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